TSL has amongst others, the following facilities 

• Clean assembly areas

• UHV compatible chemical / mechanical / plasma cleaning

• UHV leak detection facilities

• Sputter coating facilities

• Thermal evaporation

• e-beam evaporation

• Spin Coating

• Electrophoresis

• Ion beam sputtering / milling

• Lithography / micro-fabrication

• Vacuum brazing equipment

• FEA (Finite Element Analysis) modeling for structural problems 

• FEA for electron optical problems

• Optical modeling for multi-layer coatings, and ray tracing

Plasma deposition & e-beam systems

Key Benefits

• Large variety of highly complementary facilities and skills 
• Means good prices and turn around 
• Good process control gives the result needed reproducibly

Various vacuum systems for testing and prototyping